JPH0151552B2 - - Google Patents
Info
- Publication number
- JPH0151552B2 JPH0151552B2 JP60071794A JP7179485A JPH0151552B2 JP H0151552 B2 JPH0151552 B2 JP H0151552B2 JP 60071794 A JP60071794 A JP 60071794A JP 7179485 A JP7179485 A JP 7179485A JP H0151552 B2 JPH0151552 B2 JP H0151552B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- tin
- metal layer
- copper
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 125
- 239000002184 metal Substances 0.000 claims description 125
- 229910045601 alloy Inorganic materials 0.000 claims description 37
- 239000000956 alloy Substances 0.000 claims description 37
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 28
- 238000007747 plating Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 24
- 238000005323 electroforming Methods 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 16
- 229910052742 iron Inorganic materials 0.000 claims description 14
- 229910000925 Cd alloy Inorganic materials 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 229910000531 Co alloy Inorganic materials 0.000 claims description 7
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 claims description 7
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 6
- 229910001096 P alloy Inorganic materials 0.000 claims description 6
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 claims description 6
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 6
- 229910000640 Fe alloy Inorganic materials 0.000 claims description 5
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 claims description 5
- 229910000597 tin-copper alloy Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910001245 Sb alloy Inorganic materials 0.000 claims description 3
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910000611 Zinc aluminium Inorganic materials 0.000 claims description 3
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 3
- JVCDUTIVKYCTFB-UHFFFAOYSA-N [Bi].[Zn].[Sn] Chemical compound [Bi].[Zn].[Sn] JVCDUTIVKYCTFB-UHFFFAOYSA-N 0.000 claims description 3
- YAMPQRWRFJYHJN-UHFFFAOYSA-N [Cd].[Bi] Chemical compound [Cd].[Bi] YAMPQRWRFJYHJN-UHFFFAOYSA-N 0.000 claims description 3
- CSBHIHQQSASAFO-UHFFFAOYSA-N [Cd].[Sn] Chemical compound [Cd].[Sn] CSBHIHQQSASAFO-UHFFFAOYSA-N 0.000 claims description 3
- YVTIXMVVDLCGIJ-UHFFFAOYSA-N [Cd].[Sn].[Pb] Chemical compound [Cd].[Sn].[Pb] YVTIXMVVDLCGIJ-UHFFFAOYSA-N 0.000 claims description 3
- FXYGHKTWVGLQJG-UHFFFAOYSA-N [Sb].[Cu].[Sn] Chemical compound [Sb].[Cu].[Sn] FXYGHKTWVGLQJG-UHFFFAOYSA-N 0.000 claims description 3
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 claims description 3
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 claims description 3
- 239000002140 antimony alloy Substances 0.000 claims description 3
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical group [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 238000005266 casting Methods 0.000 description 12
- 230000003014 reinforcing effect Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005058 metal casting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical group [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60071794A JPS61231192A (ja) | 1985-04-04 | 1985-04-04 | 電鋳金型およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60071794A JPS61231192A (ja) | 1985-04-04 | 1985-04-04 | 電鋳金型およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61231192A JPS61231192A (ja) | 1986-10-15 |
| JPH0151552B2 true JPH0151552B2 (en]) | 1989-11-06 |
Family
ID=13470827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60071794A Granted JPS61231192A (ja) | 1985-04-04 | 1985-04-04 | 電鋳金型およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61231192A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5016742B1 (ja) * | 2011-11-15 | 2012-09-05 | 株式会社Ｌｅａｐ | 転写金型及び転写金型の製造方法 |
-
1985
- 1985-04-04 JP JP60071794A patent/JPS61231192A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61231192A (ja) | 1986-10-15 |
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